updated 08:00 am EDT, Tue April 14, 2009
2009 iPhone Supplier Leak
The companies responsible for manufacturing parts in the next major iPhone release have potentially been named by industry contacts of DigiTimes that also predict ship dates and numbers. The Taiwan-area site reinforces its previous claim that OmniVision is making a 3.2-megapixel sensor for the Apple handset's camera and now says that Largan Precision is making the rest of the imaging unit. Infineon is continuing to provide the cellular baseband (likely upgraded to 7.2Mbps 3G) as well as the GPS chipset.
Unusually, both Samsung and Toshiba are said providing the NAND flash for bulk storage, suggesting the two are offering different capacities. Apple is known to have different suppliers but normally chooses one for a given handheld device line. Samsung is also providing the DDR RAM for the handset.
Other familiar component makers from the iPhone 3G supply list include Numonyx for NOR memory, Skyworks and TriQuint for amplifying the GSM/EDGE and 3G signals, and CSR for Bluetooth. Silicon Storage Technology (SST), NXP, TXC, Foxlink, Unimicron and Nanya are also involved.
The apparently complete range of parts will be manufactured at least in part by well-known contractor Taiwan Semiconductor Manufacturing Company (TSMC) and will supposedly be shipped starting in May.
As many as 5 million iPhones are scheduled for the initial batch, which if true would represent one of the largest shipments of iPhones outside of the total 6.9 million delivered for the iPhone 3G's initial launch last summer. It's not known whether the early shipment of 2009 models would be intended for the entire quarter or simply the first wave, and a second shipment for the same quarter would likely produce a record number of iPhones shipped.
The phone itself is given only a "mid-2009" launch window in the report, though most expect an announcement at June's Worldwide Developer Conference and a release within a few weeks of the introduction.