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Hynix, Micron to join iPhone 3GS memory suppliers

updated 01:00 pm EDT, Tue July 28, 2009

 

New iPhone 3GS memory


Two more companies are set to join the ranks supplying memory for the iPhone 3GS, industry sources claim. Hynix's 41nm NAND flash is said to have recently passed 3GS validation, paving the way for future deliveries. Details of a Micron agreement have also allegedly emerged, pointing to volume shipments for Apple beginning in August. Unlike Hynix, Micron has 34nm chips ready to go, the sources say.

The largest supplier for the 3GS is currently thought to be Toshiba, which is producing 16GB chips worth approximately $24 each. Last week Apple announced a $500 million order for more Toshiba memory, covering an unspecified range of portable products. Some 3GS chips may also be coming from Samsung, which is presently said to be testing 35nm NAND for later production. Toshiba is scheduled to start 32nm memory production before the end of the year.


By Electronista Staff

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iPhone, industry, Micron, NAND, Samsung, Hynix, iPhone 3GS
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