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Next-gen Intel CULV chip to use 32nm tech

updated 02:00 pm EDT, Fri April 9, 2010

 

Intel next-gen CULV to use 32nm tech,


Intel has revealed some information about its second-generation Consumer Ultra Low Voltage (CULV) platform. Called Intel Celeron U3400, the dual-core, Arrandale 32nm-based chip will be rated at 1.06GHz and have an 18W Thermal Design Power. The CPU is will be meant for notebooks, and thus share basic design elements with the chipmaker's Calpella platform.

The component will have integrated 45nm graphics, capable of being overclocked from 166MHz to 500MHz. The processor also has 2MB of cache and support for DDR3 800 memory.

The Celeron U3400 is said to begin showing up in notebooks this fall. Unlike the Core i5 520UM, which has similar specs, the U3400 does not have 3MB of cache or a Turbo overclocking mode. [via Fudzilla]


By Electronista Staff

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Intel, computers, industry, Celeron, Calpella, CULV, Arrandale, Core i5
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