Samsung to bring moviNAND flash to smartphones

At a forum in Taiwan, Samsung announced it will soon switch to using high-performance 8GB and 16GB moviNAND embedded memory chips in its smartphones. The new memory will be the first to fully meet the latest JEDEC standard for embedded flash. The new moviNAND flash is more responsive than the previous chips thanks to a high priority interrupt and an improved ability to work in the background.

If the host device wants to execute an app or read data while the device is writing data, the host can send an HPI command so the device can respond to the newest command, reducing the amount of lag. When the embedded memory is not being used, the host can command it to compact garbage data so the embedded memory can reduce latency for the next time it's needed.

At the same time, Samsung introduced ultra-thin five chip MCP (multi-chip package) storage that measures just 1mm thick compared to the current four-chip MCPs, which are 1.15mm high. The moviNAND-based MCP will arrive at the same time as the new flash.

The 8GB moviNAND flash based on 30nm-class, 32-gigabit NAND flash chips began production in late July, with the 16GB moviNAND, 20nm-class, 32Gb NAND flash arriving later in September. Current 30nm-class 32Gb NAND flash chips will be gradually replaced with a full line of 20nm-class 32Gb NAND chips for future moviNAND products later in 2010.

Customers outside of Samsung aren't yet known; Apple is often Samsung's most frequent customer but only occasionally uses moviNAND for storage.

By Electronista Staff