updated 01:15 pm EST, Mon February 14, 2011
Intel talks about upcoming HSPA+, LTE chips
Intel on Monday announced it began shipping its XMM 6260 platform to key partners. It support HSPA+ networks for download speeds of up to 21Mbps and upload speeds as high as 11.5Mbps. Based on the 40nm architecture, it is based on the X-GOLD 626 baseband processor and the SMARTi UE2 RF transceiver.
The platform is also said to use less power than similar products from competitors, specifically ARM. It was earlier tied to an upcoming MeeGo-powered handset and can be used in USB modems, Intel says.
At the same time, the multimode XMM 7060 platform will support 2G, 3G and LTE networks. It is paired with the X-GOLD 706 multimode baseband processor and the SMARTi 4G multimode RF transceiver. The low-power and slim modem will be capable of serving up to five LTE bands, five 3G and four 2G bands at the same time.
Samples of this chip will ship in the summer, with volume shipments arriving during the second half of 2012. Both chips will be shown off at the currently ongoing MWC exhibition in Spain, likely in a handset with the Medfield processor.