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IBM and 3M creating layered chips bonded by adhesive

updated 10:35 pm EDT, Wed September 7, 2011

Tech promises up to 100 separate layers

IBM and 3M are reportedly collaborating to develop new adhesives that will be designed for layered microprocessors. The stacked technology, which could be composed of up to 100 separate layers, is said to be geared for enterprise equipment, such as servers, or consumer electronics such as computers, smartphones, tablets or gaming devices.

The technology is claimed to enable components to be tightly arranged in stacked chips that may prove to be significantly faster than the current technology. The companies are attempting to overcome challenges associated with existing adhesives, working to develop alternatives that can effectively dissipate heat from the stacks.

"Our scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor - a silicon 'skyscraper,'" said IBM research VP Bernard Meyerson. "We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low -- key requirements for many manufacturers, especially for makers of tablets and smartphones."

The companies have yet to announce a time frame for bringing the new technology onto the market. [via Network World]



By Electronista Staff
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