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Verizon Galaxy Nexus torn down, shows wide part changes

updated 01:50 pm EST, Fri December 16, 2011

Galaxy Nexus on Verizon changes multiple pieces

A new teardown of Verizon's edition of the Galaxy Nexus by TechRepublic has shown just how much of the phone has changed in the switches over to CDMA and LTE. It now uses a Silicon Motion dual-band chip and a companion VIA chip for its CDMA and EVDO-based 3G. The new Nexus uses a micro SIM slot for the card it needs for LTE where those on the HSPA+ version still use full-size cards.

The phone appears to run on a 1.2GHz Exynos 4210 processor, not the TI OMAP processor once thought. TI provides a number of companion chips, however, for things such as power. Its NFC chip is the from the same company, NXP, that fed the Nexus S.

Only some changes were made completely clear before the Galaxy Nexus reached the carrier yesterday. Verizon's model has a thicker body to accommodate a larger battery and offset some of the extra power drain from LTE. A chip swap inside was expected, but hadn't been made apparent until now.











By Electronista Staff
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