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Intel SMARTi UE2p chip to help lower 3G power, cost

updated 04:27 pm EDT, Fri July 27, 2012

System to help towards enabling Internet of Things concept

Intel has made a new system-on-chip that puts 3G power amplifiers into radio frequency circuits. The SMARTi UE2p, an improvement on its previous attempt at the platform, is smaller and more power efficient than before, while also being less complex for developers to use. Intel hopes the new SoC would bring down the cost of 3G handsets and support machine-to-machine communication to help enable the "Internet of Things."

The system integrates Intel's SMARTi UE2 HSPA 3G transceiver and 3G power amplifiers onto a single 655nm silicon die, and will be able to support multiple 3G dual-band configurations for global operation. Integration of power management and sensors allows direct connection to the device battery, simplifying device construction. Select customers will see the technology in samples during the fourth quarter, and Intel will also be collaborating with power amplifier vendors for smartphones and tablets.

The Internet of Things refers to a system where machines communicate to each other and can affect how other systems operate. For example, an alarm clock could set itself to go off two hours later if it finds out a lecture a student is supposed to attend is canceled, or a business system can automatically order more stock from a manufacturer when the number of goods stored locally is low. The European Commission is currently investigating if it needs to regulate smart appliances in the future, citing concerns over privacy, safety, security, standards, and ethics. [via Slashgear]



By Electronista Staff
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