updated 06:12 am EST, Thu November 15, 2012
Samsung starts mass-production of next-gen NAND flash
Samsung Semiconductor has begun the fabrication of new 64GB NAND flash mobile chips built on a new 10nm fabrication process. The new embedded multimedia card (eMMC) is headed for the next-generation of super slim smartphones and tablets. Compared to the previous 20nm-process, the new chips deliver 30 percent boosts to both performance and manufacturing efficiencies and use 20 percent less space.
The new design boosts write speed to 2,000 IOPS (input/output per second) and delivers random read speeds of 5,000 IOPS. In addition, sequential read and write speeds are 260 megabytes per second (MB/s) and 50MB/s respectively, which is up to 10 times faster than a class 10 external memory card that reads at 24MB/s and writes at 12MB/s. Samsung claims that this will contribute to enhancing the smoothness of multitasking on mobile gadgets.
With mass production having commenced late last month, the new NAND flash memory modules can be expected to begin turning up in devices as soon as Q1 2013.