updated 07:29 am EDT, Wed March 26, 2014
Repairability score marginally higher than original HTC One
The new HTC One is just as difficult to repair by its users as the previous model, a teardown has revealed. Repairs outfit iFixit has given the latest incarnation of the HTC flagship smartphone a repairability score of just two out of a possible ten, which is a minor improvement on the score of one for the original when it was taken apart at the same time last year.
The screwless design from the first HTC One has not been copied for the second, as iFixit soon discovered screws that allowed the rear casing to be separated from the main body. HTC is also praised by switching to spring contacts instead of a cable for the display, though efforts to take apart the insides quickly took a turn for the worse, with a large quantity of tape interfering with proceedings. Glue is also heavily used in the production of the device, damaging the chances of repair.
UltraPixel camera assembly in new HTC One (M8)
The motherboard has to be removed from the device in order to gain access to the battery, states the report, with the two components separated after removing more glue. Components on the board include a number of Qualcomm-supplied components, including the quad-core Snapdragon 801 processor clocked at 2.3GHz, RF transceiver, power management chips, and a dynamic antenna matching tuner, accompanied by flash memory from SanDisk and other components from Avago, Synaptics, STMicroelectronics, and NXT.
The final two out of ten score is down to a large number of smaller indiscretions, reveals iFixit. The burial and gluing of the battery, the fact that the display cannot be replaced without removing all other components, and the large amount of tape used in the construction works against the device, though the solid external construction and the marginally-simplified case-opening procedure does still work in its favor to raise the score above the minimum.