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<title>electronista | Broadcom News</title>
<link>http://www.electronista.com/</link>
<description>electronista is the leading source for electronic news. It offers news, reviews, discussion, tips, troubleshooting, links, and reviews every day. The best place for gadgets News. Period.</description>
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<title>Broadcom, Latest News, Headlines, Stories;</title>
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<title>Broadcom commences testing on new LTE chipset</title>
<link>http://www.electronista.com/articles/13/02/12/small.sized.offering.aimed.at.smartphones.tablets/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/article_images/article_thumbnail/1360703942_broadcomlte-sm.jpg' border='0' width='176' height='120' /><![CDATA[Broadcom on Tuesday announced that it has commenced testing of a new LTE chip with its largest customers. The chip is the first of its kind from the manufacturer, and is aimed at competing products from LTE leader and pioneer Qualcomm. Broadcom said today that it expects devices with its LTE chip to go into production in 2014....]]></description>
<guid>http://www.electronista.com/articles/13/02/12/small.sized.offering.aimed.at.smartphones.tablets/</guid>
<pubDate>Tue, 12 Feb 2013 21:15:00 GMT</pubDate>
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<title>Apple to equip 2013 Macs with 802.11ac Wi-Fi, sources say</title>
<link>http://www.electronista.com/articles/13/01/02/pact.with.broadcom.allegedly.already.signed/</link>
<description>&#60;img align='left' src='http://cdn1.macnn.com/article_images/article_thumbnail/1355168534_imac2012-duo.jpg' border='0' width='176' height='120' /><![CDATA[Apple is working on implementing 802.11ac Wi-Fi into 2013 Mac models, according to sources for The Next Web.  The people say that Apple has signed a deal with chipmaker Broadcom, even as the ac standard is still undergoing some revisions.  Modern Apple hardware, such as the iMac, supports Wi-Fi standards up to 802.11n....]]></description>
<guid>http://www.electronista.com/articles/13/01/02/pact.with.broadcom.allegedly.already.signed/</guid>
<pubDate>Wed, 02 Jan 2013 17:07:00 GMT</pubDate>
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<title>Commonly used Broadcom Wi-Fi chipset vulnerable to attack</title>
<link>http://www.electronista.com/articles/12/10/26/proof.of.concept.code.knocks.affected.devices.offline/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/article_images/article_thumbnail/1351301939_ipadiphone-sm.jpg' border='0' width='176' height='120' /><![CDATA[Proof-of-concept example code shows a vulnerability in the firmware of two wireless chips sold by Broadcom -- the BCM4325 and the BCM4329. The chips are found in recent devices such as the iPhone 4, iPad, iPad 2, HTC Droid Incredible 2, Motorola Droid X2, and some Edge model cards manufactured by Ford. The flaw makes the devices vulnerable to attacks that render the Wi-Fi connection unusable for t...]]></description>
<guid>http://www.electronista.com/articles/12/10/26/proof.of.concept.code.knocks.affected.devices.offline/</guid>
<pubDate>Sat, 27 Oct 2012 01:40:00 GMT</pubDate>
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<title>Chip suppliers stocking up for next-gen iPhone, report says</title>
<link>http://www.electronista.com/articles/12/06/15//</link>
<description>&#60;img align='left' src='http://photos.macnn.com/article_images/article_thumbnail/1338495842_iphone5tallvideo.jpg' border='0' width='176' height='120' /><![CDATA[A number of chip makers have already started stocking parts intended to be used in production of Apple's next-generation iPhone, according to industry sources for DigiTimes.  Qualcomm and Broadcom are said to be producing 4G and Wi-Fi chips using a 28nm process at Taiwan Semiconductor Manufacturing Company.  OmniVision is also said to be hunting for production at TSMC's 12-inch fab, contributing...]]></description>
<guid>http://www.electronista.com/articles/12/06/15//</guid>
<pubDate>Fri, 15 Jun 2012 14:52:00 GMT</pubDate>
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<title>Asus gaming notebook first to feature full 802.11ac </title>
<link>http://www.electronista.com/articles/12/06/07/fifth.generation.wi.fi.standard.finally.reaching.consumers/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/article_images/article_thumbnail/1339097745_Asus-80211ac-Notebook-2.jpg' border='0' width='176' height='120' /><![CDATA[Asus has unveiled its ROG G74VW gaming notebook, which will be the first consumer-oriented notebook to be fully compliant with 802.11ac, the fifth-generation Wi-Fi standard. The notebook is the result of a collaborative effort between Asus and Broadcom. The announcement of the new Asus notebook was followed by the debut of a new Asus dual-band router that also supports the Wi-Fi standard....]]></description>
<guid>http://www.electronista.com/articles/12/06/07/fifth.generation.wi.fi.standard.finally.reaching.consumers/</guid>
<pubDate>Thu, 07 Jun 2012 19:30:00 GMT</pubDate>
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<title>TSMC may get into Apple pipeline through power chips</title>
<link>http://www.electronista.com/articles/12/03/30/tsmc.gets.indirect.connection.to.apple/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/news/1203/ipad3-a5xleak.jpg' border='0' width='176' height='120' /><![CDATA[TSMC may have at least some involvement in Apple's device supply chain based on claims by Taiwan's Economic Daily News.  The business newspaper asserted that the contract manufacturer had landed deals for power management parts designed by Dialog Semiconductor for future Apple hardware.  TSMC had supposedly already involved itself with iPads and iPhones by manufacturing Broadcom, CSR, Cirrus Logic...]]></description>
<guid>http://www.electronista.com/articles/12/03/30/tsmc.gets.indirect.connection.to.apple/</guid>
<pubDate>Fri, 30 Mar 2012 19:25:00 GMT</pubDate>
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<title>New Broadcom GPS chip has 10X better position lock-ins</title>
<link>http://www.electronista.com/articles/12/03/21/broadcom.gps.mobile.chip.tech.is.more.accurate/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/news/1203/gpsin.jpg' border='0' width='176' height='120' /><![CDATA[Chipmaker Broadcom has released a new chip, the BCM4752, that uses the company's newly developed location architecture that promises a tenfold increase in performance for GPS position lock-ins. It also bolsters indoor positioning in smartphones. At the same time, the 40nm CMOS design is said to reduce power consumption by 50 percent and the total board's surface area by 44 percent....]]></description>
<guid>http://www.electronista.com/articles/12/03/21/broadcom.gps.mobile.chip.tech.is.more.accurate/</guid>
<pubDate>Wed, 21 Mar 2012 17:15:00 GMT</pubDate>
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<title>NVIDIA, Rambus make patent deal despite invalidations</title>
<link>http://www.electronista.com/articles/12/02/08/nvidia.and.rambus.sign.five.year.pact/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/news/1202/rambus-3.jpg' border='0' width='176' height='120' /><![CDATA[Rambus on Wednesday struck a deal with NVIDIA to license its patents.  The deal extends for five years and is in return for ending Rambus' lawsuit as well as any other legal action.  Other details were secret, Rambus said....]]></description>
<guid>http://www.electronista.com/articles/12/02/08/nvidia.and.rambus.sign.five.year.pact/</guid>
<pubDate>Wed, 08 Feb 2012 14:05:00 GMT</pubDate>
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<title>Raspberry Pi to begin shipping its $35 PC this month</title>
<link>http://www.electronista.com/articles/12/02/07/first.raspberry.pi.pcs.to.be.finished.by.feb.20/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/news/1107/raspberrypiin.jpg' border='0' width='176' height='120' /><![CDATA[Raspberry Pi has recently revealed it will begin shipments of its $35 PC near the end of the month. The first batch will complete its manufacturing phase on February 20, with the first buyers expected to take delivery before month's end. That first PC will be sized similarly to a deck of playing cards and is not much more than a bare board with a number of connections....]]></description>
<guid>http://www.electronista.com/articles/12/02/07/first.raspberry.pi.pcs.to.be.finished.by.feb.20/</guid>
<pubDate>Tue, 07 Feb 2012 21:25:00 GMT</pubDate>
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<title>USPTO invalidates key Rambus patent, may lower tech costs</title>
<link>http://www.electronista.com/articles/12/01/27/uspto.rules.last.of.3.core.rambus.patents.invalid/</link>
<description>&#60;img align='left' src='http://photos.macnn.com/news/1201/rambus-3.jpg' border='0' width='176' height='120' /><![CDATA[Rambus' litigation campaign suffered a possibly fatal setback Friday after the USPTO pushed word that it had invalidated the final patent out of three the company has been using to sue a large part of the technology industry.  Having quietly made the decision on Tuesday, the patent office's appeals board left Rambus without any of the patents it has been using to sue NVIDIA, Hynix, HP, and others....]]></description>
<guid>http://www.electronista.com/articles/12/01/27/uspto.rules.last.of.3.core.rambus.patents.invalid/</guid>
<pubDate>Fri, 27 Jan 2012 22:50:00 GMT</pubDate>
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