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Hybrid Memory Cube standard completed by consortium

04/03, 9:56am

Memory bandwidth speed multiple times that of current DRAM

The Hybrid Memory Cube Consortium has published its first specification for HMC. Specification 1.0, after 17 months of work by the companies forming the consortium, details how manufacturers can create platforms and RAM using 2GB, 4GB, and 8GB chips, offering high-speed memory architectures that are also power-efficient.

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Microsoft joins Hybrid Memory Cube Consortium

05/09, 4:04pm

Microsoft takes interest in 3D memory chip technology

Microsoft has joined the Hybrid Memory Cube Consortium. Fronted by Micron, Samsung, and IBM, the HMCC aims to create more efficient memory for high-performance computing and other similar applications, using increased bandwidth compared to what current memory architectures can provide.

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